SUSS MJB4, User Manual, Page: 44 / 164

OPERATION OF THE
MJB4
34
MJB4 - Operation Rev02 01-06
3
gradually reduce these times.
All parameters can be set in the EXPOSURE
VALUES menu. To test the set values and the
adjustment, use the CHECK ADJUSTMENT button.
Low Vacuum Contact Exposure
This exposure type is identical to the vacuum
contact exposure with one exception: the vacuum in
the vacuum chamber can be read in the display
under VAC CHAMBER and set using the controller
provided for this purpose. This allows high structure
resolution of the vacuum contact exposure to be
combined with the least possible mechanical stress
from the substrate and mask. To test the set values
and the adjustment, use the CHECK ADJUSTMENT
button.
Eexposure
This type allows the entire substrate to be exposed
without the mask. Once this exposure type is set in
the EXPOSURE VALUES menu, the sequence can
be started by switching the contact lever. The
substrate is exposed according to the set exposure
time regardless of whether or not the mask holder
was loaded.
3.7.2. Multiple Exposure
For special applications or to determine exposure
times, the entire exposure time can be divided into
equal intervals. A wait time must in which no
exposure occurs must be set between these
intervals.
One exposure interval and one wait time are
referred to as an exposure cycle.
The following parameters must also be specified for
multiple exposure:
Exposure Cycles
Pressing this button allows you to enter the num-
ber of desired exposure cycles (min. 2) and then
confirm your entry with the ENTER button.
Now the following buttons appear in the EXPO-
SURE VALUES menu:
Pause Time
Sets the wait time between individual cycles.
Exposure Time
Pressing this button opens the EXPOSURE
TIME menu, which allows you to enter the de-
sired single exposure time. Press ENTER to con-
firm your entry. The display automatically
switches back to the EXPOSURE VALUES
menu and adds the value that you just set.
Press the right/left arrow buttons to add the set pa-
rameters.
Load, adjust and expose the substrate as described
above.