SUSS MJB4, User Manual, Page: 43 / 164

OPERATION OF THE
MJB4
MJB4 - Operation Rev02 01-06
33
3
3.6.2.5. Adjusting the Substrate
Focusing the Substrate Level
For fine lens adjustment, use the OBJECTIVE
FOCUS FINE MANUAL knob on the microscope.
Adjustment (menu in the SUBSTRATE ADJUST-
MENT display)
The X, Y and theta micrometer screws on the
adjusting table are used for adjustment. Align the
substrate adjusting crosses so that they are central-
symmetrical to the mask adjusting crosses.
Never adjust the substrate if the mask
and substrate are in contact! Doing so
will damage the mask and substrate.
Checking the Adjustment
See section 1.2.7. "Buttons in the Display / Touch
Screen".
3.6.2.6. Exposure
Once the substrate is adjusted and brought to the
exposure position using the SEPARATION LEVER,
press the EXPOSE button to perform the exposure.
You must press YES again on the display to confirm
the exposure.
If you press NO or use the CONTACT or
SEPARATION LEVER, the sequence is initiated
with the shutter closed. The substrate can now be
unloaded or readjusted.
Caution!
Microscope in motion!
3.6.2.7. Unloading the Mask
To release the mask holder, remove both screws on
the right side of the mask holder frame. Take out the
mask holder and place it on a tray upside down.
Switch off the mask vacuum by pressing the
MASKVACUUM IS ON button.
The mask can now be removed.
3.7. Advanced Techniques
3.7.1. Exposure Programs
An important parameter for exposure is the type of
contact between the mask and substrate. The type
of exposure program and all the parameters it
requires are selected and edited in the EXPOSURE
VALUES menu.
Distance Exposure
Wedge error compensation takes place in contact.
After the substrate is adjusted to the mask, exposure
is carried out at a specific distance which can
measure down to 50 µm.
The substrate intake vacuum is maintained during
exposure.
Soft Contact Exposure
The mask and substrate are brought into contact.
The structure resolution is better than in distance
exposure. The substrate intake vacuum is
maintained during exposure. The pressing force of
the substrate against the mask is equal to the force
applied for wedge error compensation.
Hard Contact Exposure
This exposure type is similar to the soft contact
exposure. After the substrate is in contact, the
substrate intake vacuum is switched off and
replaced with nitrogen overpressure. This
guarantees better contact, even for exposing larger
substrates. To test the set values and adjustment,
use the CHECK ADJUSTMENT button.
Vacuum Contact Exposure
This exposure type ensures the highest structure
resolution. It requires a vacuum-capable chuck with
a sealing lip. The substrate is in a mini vacuum
chamber from which the air is gradually extracted.
The pre-vacuum ensures that the mask-substrate
contact is established slowly. It also prevents gas
bubbles from forming under the substrate. In the
next stage the final vacuum is applied. The intake
vacuum is then replaced with nitrogen overpressure.
This results in the best possible contact between the
mask and substrate. Following exposure, the mini
chamber is flushed with nitrogen. Larger substrates
increase the time required for extraction and
ventilation. For the best results, it is recommended
to start a test series with long times and then