14
Super X12DPG-AR User's Manual
Note:
The table above is continued on the next page.
Motherboard Features
CPU
•
Supports two 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 CPU cores per CPU and a thermal
design power of up to 270W
Memory
•
Supports up to 4TB 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of
3200/2933/2666 MHz in 16 memory slots and up to 4TB Intel Optane PMem 200 Series with speeds of up to 3200 MHz
Note 1:
Intel® Optane™ Persistent Memory (PMem) 200 Series are supported by the 3rd Gen Intel Xeon Scalable
(83xx/63xx/53xx/4314 Series) Processors.
Note 2
: Memory speed and capacity support depends on the processors used in the system.
DIMM Size
•
Up to 256GB at 1.2V
Note 1:
For the latest CPU/memory updates, please refer to our website at
http://www.supermicro.com/products/
Chipset
•
Intel PCH C621A
Expansion Slots
•
Six PCIe 4.0 x16 slots for GPU supporting up to 350W
•
Two PCIe 4.0 x8 low-profile slots (optional)
•
Two M.2 PCIe 3.0 x4 slots (with support for M-Key 2280 and 22110)
•
One PCIe 4.0 x8 AIOM slot
Network
•
One PCIe 4.0 x8 AIOM slot
•
One dedicated BMC_LAN located on the rear I/O panel
Baseboard Management Controller (BMC)
•
ASPEED AST2600 BMC
Graphics
•
Graphics controller via ASPEED AST2600 BMC
I/O Devices
•
Eight hot-swap SATA 3.0 ports and six 2.5 hot-swap NVMe U.2 ports
•
Two USB 3.0 ports on the rear I/O panel
•
Two USB 2.0 ports on the front panel
Motherboard Features
