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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Generation Intel® Xeon® Scalable processorss in an LGA4189 socket; UPI up to 11.2GT/s; supports CPU TDP up to
270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel® C621A
BIOS
AMI 128Mb SPI Flash EEPROM
Memory
32 DIMM slots for up to 8TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 3200/2933/2666
or 8TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHz
Storage Drives
Six 2.5” hot-swap NVMe/SAS/SATA drive bays
Four optional rear 2.5” NVMe drives
Two NVMe/SATA3 M.2
PCI Expansion Slots
Two front PCIe Gen 4 x16 slots (from CPUs)
Eight rear PCIe Gen 4 x16 slot (from PLX)
One AIOM PCIe Gen 4 x16
Input/Output
One dedicated BMC port
One VGA port
Two front USB 3.0 ports
Motherboard
X12DGO-6; (LxW) 16.89 x 15.01 in., (429 x 381 mm)
Chassis
CSE-438G; 4U rackmount, (WxHxD) 17.6 x 6.9 x 35.4 in. (446 x 174 x 900 mm)
System Cooling
Four 9-cm counter-rotating fans (GPU node)
Eight 4-cm counter-rotating fans (CPU node)
One CPU air shroud
Two GPU air shrouds
