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11

Technical data

NOTE

The relevant online data sheet for your product, including technical data, dimensional
drawing, and connection diagrams can be downloaded, saved, and printed from the
Internet:

www.sick.com/SIM10xx

Please note: This documentation may contain further technical data.

11.1

Features

Table 10: Features

Feature

Parameter

Task

data recording, evaluation, and archiving

Supported devices (excerpt)

Encoders, code readers, RFID read/write devi‐
ces, SICK LiDAR sensors, SICK picoCam and
midiCam (note regarding compatible firmware
versions

"ETHERNET 2-3: PoE Out", page 18

Technology

Embedded hardware architecture:

dual-core ARM Cortex-A9 CPU with NEON
accelerator

FPGA for I/O handling

Software:

Can be programmed within the SICK
AppSpaceenvironment

SICK Algorithm API

Random Access Memory

1 GB

Flash memory

256 MB in total, 30 MB of which available for
applications

memory card (optional)

Industry-grade microSD memory card (flash
card), max. 32 GB

Programming software

SICK AppSpace

Sensor data processing

According to SICK Algorithm API

11.2

Interfaces

Table 11: Interfaces

Feature

Parameter

User interfaces

Web server (GUI), SICK AppStudio (program‐
ming), SICK AppManager (app installation,
firmware update)

Data storage and retrieval

Image and data logging via microSD memory
card, internal RAM, and external FTP

ETHERNET

Quantity

3

Function

Data output, configuration, firmware update
ETH1: PoE In
ETH2-3: PoE Out

Data transmission rate

10/100/1,000 Mbit/s

Protocol

TCP/IP, FTP (image transfer), OPC-UA, MQTT

11 

TECHNICAL DATA

26

O P E R A T I N G   I N S T R U C T I O N S | SIM1004

8023516/1BQH/2021-07-28 | SICK

Subject to change without notice

Summary of Contents for SIM1004

Page 1: ...O P E R A T I N G I N S T R U C T I O N S SIM1004 Sensor Integration Machine...

Page 2: ...ble within the limits of the legal determination of Copyright Law Any modi fication abridgment or translation of this document is prohibited without the express written permission of SICK AG The trade...

Page 3: ...s 12 4 Transport and storage 13 4 1 Transport 13 4 2 Transport inspection 13 4 3 Storage 13 5 Mounting 14 5 1 Overview of mounting procedure 14 5 2 Scope of delivery 14 5 3 Preparing for mounting 14 5...

Page 4: ...issioning 25 10 1 Disposal 25 11 Technical data 26 11 1 Features 26 11 2 Interfaces 26 11 3 Mechanics and electronics 27 11 4 Ambient data 27 12 Annex 29 12 1 Dimensional drawing 29 12 2 Licenses 29 C...

Page 5: ...n on operating the machine or system in which the device is integrated Information on this can be found in the operating instructions for the machine or system 1 2 Explanation of symbols Warnings and...

Page 6: ...Dimensional drawings and 3D CAD dimension models of the device types in various electronic formats Other publications related to the devices described here Publications dealing with accessories 1 4 S...

Page 7: ...s are possible depending on the device specific properties The device is programmed on a PC by using the development environment software SICK AppSpace Depending on the application a browser based gra...

Page 8: ...nufacturer accepts no liability for damage caused by Non adherence to the product documentation e g operating instructions Incorrect use Use of untrained staff Unauthorized conversions or repair Techn...

Page 9: ...e work safety regulation The following qualifications are required for various activities Table 1 Activities and technical requirements Activities Qualification Mounting maintenance Basic practical te...

Page 10: ...tial equalization currents Improper grounding can lead to dangerous equipotential bonding currents which may in turn lead to dangerous voltages on metallic surfaces such as the housing Electrical volt...

Page 11: ...ated via IO Link for example for distance and height meas uring purposes Ethernet interfaces with OPC UA and MQTT provide preprocessed data edge comput ing for cloud computing In addition the SIM can...

Page 12: ...h one or more Ethernet switches it is essen tial to use only jumbo frame compatible 1 GigE switches Switches limited to just 100 Mb s do not support the data packet mode used by cameras and can cause...

Page 13: ...transit In the case of transit damage that is visible externally proceed as follows Do not accept the delivery or only do so conditionally Note the scope of damage on the transport documents or on th...

Page 14: ...NOTE For a list of cables suitable for use with the device see supportportal sick com or at www sick com 5 3 Preparing for mounting Installation requirements NOTE The specific mounting instructions m...

Page 15: ...wing extended installation conditions must be taken into account when mounting the device Prerequisites Aluminum profiles for mounting on the system min 40 x 40 mm and 500 mm in length No direct sunli...

Page 16: ...t be con nected NOTE Layout of data cables Use screened data cables with twisted pair wires Implement the screening design correctly and completely To avoid interference e g from switching power suppl...

Page 17: ...net with PoE 3 SENSOR connection with digital inputs outputs and voltage supply Can be alternatively used as a IO Link master connection 4 microSD card slot 5 USB connection Micro B for configuration...

Page 18: ...ly 1 D1 DC 2 D1 DC 3 D2 DC 4 D2 DC 5 D4 6 D4 7 D3 8 D3 Additional notes The ETH2 3 connections with PoE Out can be used to connect to picoCam and midiCam family cameras and SICK LiDAR sensors as well...

Page 19: ...level 21 V Max low output logic level 3 V Push pull switch Max IO Link output frequency 230 kHz Max IO output frequency 30 kHz Digital inputs Min high input logic level 12 V Max low input logic level...

Page 20: ...nd screw together tightly 4 Seal unused connections with dummy plugs 6 7 Connecting voltage supply NOTICE Risk of damage to peripheral devices If peripheral devices are connected when the voltage supp...

Page 21: ...environment for the time being to check network communication if necessary Note the company standards that apply to the use of checking and testing devices For initial programming use ideal conditions...

Page 22: ...plant area into which the device is incorporated Meaning of symbols Table 5 Explanation of characters Symbol Meaning LED off LED on LED flashes LED goes out briefly LED lights up briefly 8 2 Device st...

Page 23: ...Voltage not applied to the connection Signal activity ETHERNET 1 3 Table 8 Ethernet 1 3 Location Designation LED behavior Description Link Act Connection not established with Ethernet Connection esta...

Page 24: ...ntenance tasks may be required for the device at regular intervals Table 9 Maintenance plan Maintenance work Interval To be carried out by Check device and connecting cables for damage at regular inte...

Page 25: ...y manner in accordance with the applicable country specific waste disposal regulations Do not dispose of the product along with household waste NOTICE Danger to the environment due to improper disposa...

Page 26: ...within the SICK AppSpaceenvironment SICK Algorithm API Random Access Memory 1 GB Flash memory 256 MB in total 30 MB of which available for applications memory card optional Industry grade microSD mem...

Page 27: ...V according to PoE technology via ETH1 SIM power consumption 10 W max without connected sensors Total power output ETH2 ETH3 Available power at the input of the SIM minus SIM power consumption minus...

Page 28: ...site Height position Degree of contamination Use inside buildings max 2 000 m 1 Ambient operating temperature 0 C 50 C taking the described mount ing requirements into account see Mounting page 14 Sto...

Page 29: ...zlib license and licenses derived from the BSD license This program is provided for general use without warranty of any kind This warranty disclaimer also extends to the implicit assurance of marketa...

Page 30: ...080 7425 E Mail enquiry my sick com Mexico Phone 52 472 748 9451 E Mail mexico sick com Netherlands Phone 31 0 30 229 25 44 E Mail info sick nl New Zealand Phone 64 9 415 0459 0800 222 278 tollfree E...

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