Contents
1
About this document........................................................................
1.1
Information on the operating instructions..............................................
1.2
Explanation of symbols............................................................................
1.3
Further information...................................................................................
2
Safety information............................................................................
2.1
2.1.1
Conditions for specified enclosure rating..............................
2.1.2
Cover on the device.................................................................
2.2
2.3
Cybersecurity............................................................................................
2.4
2.5
Modifications and conversions................................................................
2.6
Requirements for skilled persons and operating personnel..................
2.7
Operational safety and specific hazards.................................................
2.8
3
Product description........................................................................... 12
3.1
3.2
3.3
3.4
3.5
Display and operating elements..............................................................
3.6
Acoustic status indicator..........................................................................
3.7
MicroSD memory card..............................................................................
3.8
Function and use......................................................................................
3.9
2D codes...................................................................................................
4
Transport and storage....................................................................... 18
4.1
Transport...................................................................................................
4.2
Unpacking.................................................................................................. 18
4.3
4.4
5
Mounting............................................................................................. 19
5.1
5.2
Preparation for mounting.........................................................................
5.2.1
Installation requirements........................................................
5.2.2
Mounting systems.................................................................... 19
5.3
Mounting location.....................................................................................
5.3.1
Determining alignment............................................................
5.3.2
Working range..........................................................................
5.3.3
Mounting angle........................................................................
5.4
Mounting the device.................................................................................
CONTENTS
8024289/1E1C/2022-09-09 | SICK
O P E R A T I N G I N S T R U C T I O N S | GLS621
3
Subject to change without notice