SEPTENTRIO mosaic Series, Hardware Manual

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4.8 Event/TimeSync inputs ......................................................................................... 23
4.9 PPS output .............................................................................................................. 24
4.10 General Purpose Output (GPx) ............................................................................ 24
4.11 LEDs ......................................................................................................................... 25
4.12 Standby ................................................................................................................... 25
4.13 RTC ........................................................................................................................... 27
5 MOSAIC INTEGRATION .............................................................................................. 28
5.1 Minimal Design ...................................................................................................... 28
5.1.1 Single-Antenna Modules ...................................................................................... 29
5.1.2 Dual-Antenna Modules ........................................................................................ 30
5.2 Electrical Recommendations ............................................................................... 30
5.3 Decoupling.............................................................................................................. 31
5.4 Power States .......................................................................................................... 31
5.5 Layout Recommendations ................................................................................... 32
5.5.1 Coplanarity ............................................................................................................ 32
5.5.2 Power ..................................................................................................................... 32
5.5.3 Antenna Inputs ..................................................................................................... 32
5.5.4 Avoiding Self-Interference.................................................................................... 33
6 PRODUCT HANDLING ................................................................................................ 34
6.1 ESD Precautions ..................................................................................................... 34
6.2 ROHS/WEEE NOTICE ............................................................................................... 34
6.3 Packaging ............................................................................................................... 35
6.3.1 Packing List Label.................................................................................................. 36
6.3.2 MSL Level Label ..................................................................................................... 36
6.4 Storage .................................................................................................................... 37
6.4.1 Note for Small Quantities .................................................................................... 37
6.5 Sticker and Identification ..................................................................................... 37
6.6 Soldering ................................................................................................................. 38
6.6.1 Solder Mask ........................................................................................................... 38
6.6.2 Reflow Profile ........................................................................................................ 38
7 DEVELOPMENT KIT .................................................................................................... 40