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Product Handling
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6.4
Storage
Dry-pack shelf life is according to JEDEC standard J-STD-033 with 12 months at < 40°C and
< 90% relative humidity (RH). After the 12-month period, baking is recommended prior to
reflow on customer boards.
The moisture sensitivity level (MSL) is 3.
If the dry pack has been opened for more than 168 hours or can no longer be considered
dry, the modules must be baked according to JEDEC standard J-STD-033 Table 4-1
Reference Conditions for Drying Mounted or Unmounted SMD Packages. The
recommended baking condition is 25 hours at 90°C <= 5% RH.
Oxidation Risk
: Baking may cause oxidation and/or intermetallic growth of the
terminations, which if excessive can result in solderability problems during board
assembly. The cumulative bake time at a temperature greater than 90°C and up to 125°C
should not exceed 96 hours.
Bake temperatures higher than 125°C are not allowed.
The 27-position tray cannot sustain baking temperature. The mosaic modules have to be
baked separately from the shipment tray.
6.4.1
Note for Small Quantities
For small quantities requested for prototype usage, Septentrio or Septentrio distributors
may not be able to supply the modules in dry-pack packaging. In that case, the customer
should consider that the components have exceeded their floor life. To prevent damaging
the modules during soldering, they need to be baked prior to any reflow.
6.5
Sticker and Identification
The 2D barcode contains the module hardware version and serial number, e.g:
MOSAIC-X5GRB-0051-1000-BA3P2SN19293054938
The serial number is also printed under the barcode.
Pin A1
