38
38
Product Handling
38
6.6
Soldering
6.6.1
Solder Mask
Non-soldermask defined (NSMD) pads are recommended, with a clearance of 75µm
between the copper pad and the solder mask, as shown in the below figure. The copper
pads are in green, the (negative) solder mask is in pink. Dimension in millimeters.
The GND and VDD_3V3 pins are an exception in this respect. They can be soldermask-
defined, allowing to route them using a plane.
6.6.2
Reflow Profile
Reflow soldering is the soldering method recommended to assemble mosaic modules.
The recommended temperature profile is specified with the graphic below. Refer also to
“IPC
-7530A: Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow
and Wave)
”
.
The final reflow profile shall be based on leadfree process and depends on parameters
such as the soldering paste, host board parameters (shape, thickness
, etc…) and
oven
capabilities.
Exceeding the maximum soldering temperature in the recommended soldering profile
may permanently damage the module.
