Reference Information
Service Manual
6-5
Samsung Electronics
SPECIAL SCREW(PANNEL MFP)
MFP =Multi-Functional Peripheral
A/S MATERAL-DUMMY UPPER ASS’Y
A/S=After-Service
MCT-GLASS ADF
MCT= Machinery Cutting
ADF=Automatic Document Feeder
PPR-REGISTRATION EDGE(F)
PPR= Processing Press
IPR-HOLDER GLASSI
PR=Iron Press
MCT-GLASS SCANNER(LEGAL)
MCT= Machinery Cutting
CBF HARNESS-OPE
OPE=Operation Panel(Control Panel)
PBA SUB-D_SUB
PBA SUB-D_SUB =>Sub Printed circuit Board
Assembly for the D-SUB type electrical connector
(D-Sub) a kind of the connector type(shape ‘D’)
COVER-M-CCD CABLE
M=Mold
CCD=Charge Coupled Device
COVER-SCAN LOWER(UMAX)
UMAX=> Supplier’s name for CCD module
ICT-INSERT SHAFTI
ICT= Iron Cutting
IPR-BRK SCAN BD
IPR=Iron Press
BRK=Bracket
BD= Board
CBF SIGNAL-CCD FFC
CCD = Charge Coupled Device
FFC =Flexible Flat Cable
COVER-M-OPE
M=Mold
OPE=Operation Panel(Control Panel)
KEY-M-COPY
M=Mold
PLATE-M-ALPHA KEY
M=Molde
ALPHA=Alphabet
PMO-GUIDE DP SIDE
DP=Duplex
RING-CS
CS= Compress
GEAR-MP/DUP DRV
MP =Multi-Purpose (Bypass) tray
DUP DRV = Duplex Driver
IPR-BRKT G DUPI
PR=Iron Press
BRKT=BRACKET
G= Ground
UP=Duplex
PMO-BUSHING TX(B4)
TX=Transmit
PMO-TRAY CASE, MP
MP=Multi-Purpose tray(Bypass tray)
ACRONYM
EXPLANATION
