NXP Semiconductors
UM11637
FRDMGD3160DCMHB evaluation board
Contents
Important notice ..................................................3
FRDMGD3160DCMHB ......................................... 3
Getting started .................................................... 4
Kit contents/packing list .....................................4
Required equipment .......................................... 4
System requirements .........................................5
Getting to know the hardware ........................... 5
Overview ............................................................5
Board features ................................................... 5
Device features ..................................................6
Board description ...............................................6
Low-voltage logic and control connector ............7
Test point definitions ..........................................9
Power supply and jumper configuration ...........11
Bottom view ..................................................... 12
Gate drive resistors ......................................... 13
Kinetis KL25Z Freedom board .........................14
3.3 V to 5.0 V translator board ........................ 15
Configuring the hardware ................................ 16
Half-bridge configuration ..................................16
System setup ...................................................16
Quick start ....................................................... 17
Normal mode SPI configuration .......................17
Daisy chain SPI configuration ..........................18
Three-phase configuration ...............................20
System setup ...................................................20
Quick start ....................................................... 21
Installation and use of software tools .............23
Installing FlexGUI on your computer ............... 23
Configuring the FRDM-KL25Z microcode ........23
Using the FlexGUI ........................................... 24
Troubleshooting ............................................... 38
Schematics, board layout, and bill of
materials .............................................................39
References .........................................................39
Legal information ..............................................40
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2022.
All rights reserved.
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Date of release: 3 February 2022
Document identifier: UM11637