NXP Semiconductors
UM11637
FRDMGD3160DCMHB evaluation board
For half-bridge evaluation, you need:
•
DCM
™
1000X SiC MOSFET module from Danfoss Silicon Power (Danfoss P/N:
135L0655; BR1056 DP660B1200T105606)
•
DC link capacitor compatible with the DCM
™
1000X module (Danfoss P/N: 135B0234)
For three-phase evaluation, you need:
•
DCM
™
1000X SiC evaluation kit from Danfoss Silicon Power (three power modules, DC
link, cooler plate, and accessories) (Danfoss P/N: 135F9007)
•
Two additional FRDMGD3160DCMHB boards (one for each power module)
3.3 System requirements
The kit requires the following to function properly with the software:
•
Windows 7 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160DCMHB is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3160 gate drivers. The evaluation kit can be connected
to a compatible SiC module for half-bridge or three-phase evaluations and applications
development.
4.2 Board features
•
Capability to connect to DCM
™
1000X module for half-bridge or three-phase
evaluations
•
Negative VEE gate low drive level (−3.9 V DC)
•
VCCREG regulated high gate drive level (+15 V DC)
•
Jumper configurable for disabling dead time fault protection when short-circuit testing
•
Easy access power, ground, and signal test points, external pulse width modulation
(PWM) input
•
Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•
DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•
Positive temperature coefficient (PTC) connection and configurable for monitoring
module temperature
UM11637
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© NXP B.V. 2022. All rights reserved.
User guide
Rev. 2 — 3 February 2022
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