QUICK2025 manual operation
Page 1
1. Summary
Thank you for using QUICK BGA2025 Rework System. This system, which adopts microprocessor control and
infrared sensor technology to solder and de-solder to surface mount components safely and accurately. It also
can control the whole technical process and record all the information by means of the BGA Software, thus
satisfying the higher technical demands of modern electronic industry. It is one of the most valued electronic
equipments in electronic field.
QUICK BGA2025 Rework System adopts infrared sensor technology and closed–loop principle, integrating
harmoniously the infrared heater and the sirocco heater together. In order to control the soldering process
optimally and get the nondestructive and reproductive PCB temperature, QUICK BGA2025’s heating power is
up to 3500W. Top heater is infrared and the heating power and the heating window are adjustable, infrared
sensor detects the surface temperature of the BGA and the curve of the Temperature can control the detecting
temperature. Bottom heater uses not only the infrared heater but also sirocco heater. The sirocco heater is part
heating to the PCB of the BGA bottom with temperature’s curve controlling and infrared heater is to the whole
PCB with controlling the preheating temperature to prevent the board from transfiguration. For more
preciseness technics demands and effectual controlling the PCB temperature and the encapsulation temperature,
the technology of re-flow soldering controlled by closed-loop ensures the precise and smaller technical window,
even heat distribution and appropriate peak value of temperature for lead-free soldering. Besides, the infrared
heater is suitable for all applications, such as large or small PCB and lead-free solder, moving automatically in
X-axis to heating the PCB evenly.
Optics aligning prism of QUICK BGA2025 Rework System expands to 60*60mm from 40*40mm. Big BGA
alignment can see clearly and the aligning lens are controlled by the step motor and the chip slave is above the
lens. The PCB fixture is square and the maximum size is 600*500mm, the width of the left and right arms can
be adjusted and the abnormity knightheads can be fixed on the arms. On the fixture, there are X
micro-adjusting knob and Y micro-adjusting knob for precise alignment and the bottom knighthead is
connecting with the arm to keep identical placing position of PCB.
For reducing the manual effects, QUICK2025 BGA rework system can automatically run the processes except
adjusting X
、
Y
、θ
with hand for precise alignment. Besides, the chip sucking and pasting, lens moving, reflow
controlling, heating moving and chip de-solder are all automatic controlled by the step motor. And the system
has the controlling software with wide screen display of LCD to multi-control the processes unaided or by the
outer computer.
The new BGA rework system has the advantages of the infrared heater and sirocco heater, satisfying the
demands of reworking the BGA, especially in lead-free soldering.
