background image

 

QUICK2025 manual operation 

 

Keyboard 

A、 

control the cursor moving to left or right and data modifying with UP

DOWN

LEFT

RIGHT  key at any 

interface  

B、 

Function of the “SET” key is confirming the input information and function of the “SAVE” key is saving 

the information and than exiting the process.   

C、 

BEGIN key

Make the system into the reflow de-solder process or reflow solder process in the waiting 

state 

D、 

EXIT key

Exit the current running process after pressing it and back to the starting state after pressing it again   

E、 

T-H

(↑)

and T-H

(↓)

  key: Control the top heater moving up and down by manual   

F、 

SUCKER

(↑)

and  SUCKER

(↓)

key: Control the nozzle moving up and down   

G、 

CAM-CON key: controlling the position of the aligning arm inside or outside   

H、 

SUCK key

Make the system into the chip sucking state and suck the chip   

I、 

PASTE key: controlling the chip placing 

J、 

FAN-CON key: controlling the cooling fan. Cooling fan starts to work after pressing the key and bottom             

sirocco nozzle blows cool air. Cooling fan stops work and does not blow cool air when 

pressing it again.   

K、 “

FOCUS+

and 

FOCUS-

key: For camera focusing 

L、 “

ZOOM+

 and 

ZOOM-

  key: Zooming the image 

M、 

“RED+”  and  

RED-

key: Adjusting the brightness of the top red light   

N、 

“WHITE+” and 

WHITE-

  key: Adjusting the brightness of the bottom white light 

O、 

CA L key

In the process of reflow de-solder or reflow solder, pressing the key when the temperature       

between T2 and T3, make TC is equal to TL to multiply the coefficient by current 

temperature. It is calibrating the parameter of TEL and saving it (in the hole of CAL). 

 

Note: It must be in the DATA interface to cancel the calibrating. Setting the “CAL” parameter as “OFF” 

to cancel the calibrating quotiety back to initial state. In initial state, please do not press the key 

CAL that will affect the calibrating of the other temperatures. If pressing the key CAL not carefully, 

please press the key SAVE on time exiting the process. This is different to the other rework system 

QUICK2005 and QUICK2015.

 

 

* Aligning arm instruction 

Aligning arm is used in the element alignment. In the aligning arm, there is a camera which transmitting the 

information by video cord and then displaying the image about the soldering point in the PCB and element 

pins below the nozzle. Users can observe element alignment by adjusting function keys.

 

Page 11 

Summary of Contents for BGA 2025

Page 1: ...k you for purchasing our BGA SMD Rework System The system is exclusively designed for reworking and soldering SMD component Please carefully read this manual before operating the system Store this man...

Page 2: ...g the PCB temperature and the encapsulation temperature the technology of re flow soldering controlled by closed loop ensures the precise and smaller technical window even heat distribution and approp...

Page 3: ...wing parts are included and intact Main Unit BGA2025 Sirocco nozzle PC and LCD Display Screen BGA2025 Operation Manual K type sensors Video line BGA Toolbox Note The parts will be packed according to...

Page 4: ...y an experienced and authorized technician or expert or contact with service agent and factory The unit with dangerous voltage The inexperienced maintenance is dangerous for the operators 5 Specificat...

Page 5: ...B The real temperature of bottom sirocco heater KIR The real temperature of bottom Infrared heater IRT The real temperature of IR sensor inspecting S0 Heating time from T0 to T1 S1 Heating time from T...

Page 6: ...S1 T2 S2 T3 S3 TL TIR TB1 TB2 BF A SEN TYP CA L 0 90 40 145 50 160 55 200 30 183 150 140 160 9 0 0 0 1 90 55 145 50 155 40 200 20 183 165 130 150 9 0 1 0 2 90 40 140 50 150 50 200 15 183 160 125 145...

Page 7: ...e LCD please unscrew the fixed knob and lock screw to adjust the LCD to suitable height and then screw down the fixed knob and lock screw Fixed screw Lock screw LCD Fixed knob 6 3 Connect the Equipmen...

Page 8: ...TOS The system is a closed loop temperature controlling Testing the temperature of BGA surface with infrared temperature sensor Besides bottom sirocco and infrared heater test the temperatures with o...

Page 9: ...play window Air blow meter APERTURE ADJUSTING The aperture system of the top infrared heater is adjustive from 20mm 60mm to 60mm 60mm by one adjustment knob Unscrew the knob before adjusting and adjus...

Page 10: ...CB move the infrared heater in X axis to ensure even heating of the PCB Nozzle of the sirocco heater PCB fixture Bottom infrared heater Bottom Preheater The size of the bottom infrared preheater is 45...

Page 11: ...ixture Lock Knobs when the elements precise align screw down the lock knobs before micro adjusting Turn micro adjusting knob one for moving the PCB fixture to left or right The PCB fixture to right wh...

Page 12: ...gain K FOCUS and FOCUS key For camera focusing L ZOOM and ZOOM key Zooming the image M RED and RED key Adjusting the brightness of the top red light N WHITE and WHITE key Adjusting the brightness of t...

Page 13: ...nient by micro adjusting Aligning arm inside Aligning arm outside Nozzle Instruction The nozzle will act during the process of placing and sucking the chip SUCKER and SUCKER keys control the nozzle mo...

Page 14: ...ature is 80 TC and TB show room temperatures in initial state Press SET key to select the T0 080 and then press SET key again into the setting state Cursor is in the 1 s digit of the selecting item Pr...

Page 15: ...word 000 If user needs to modify the password inputting the new password again with the above method It will display Saving Password when successfully modify Note it must input the right password if u...

Page 16: ...processes all have password protection and authority setting to ensure the reliable technics Note It must be in the DATA interface to cancel the calibrating Setting the CAL parameter as OFF to cancel...

Page 17: ...temperature rises to T2 when to the time S1 During this time PCB and component pre heating is finished and the solder is activated Use the UP DOWN RIGHT LEFT RIGHT SET and SAVE key to set the values...

Page 18: ...splayed and used for process controlling Use the UP DOWN RIGHT LEFT RIGHT SET and SAVE key to set the values of TEL when modifying the parameters Password It is used for setting password It is designe...

Page 19: ...unds unvaryingly the top heater move upwards Top cooling fan blows cooling air and bottom sirocco nozzle stop blowing warm air to blow cooling air The effect of cooling is better when blowing cooling...

Page 20: ...cally when pressing PASTE The aligning process is over and it s the time to solder 2 3 4 1 4 2 4 3 4 4 7 8 9 1 9 2 9 3 9 3 Intelligent Processes Instruction BGA2025 has three intelligent processes tha...

Page 21: ...o top begin pressing SUCK when the system in idle Top heating arm stop downwards Delay one second Top heating arm downwards Alignment arm turn to outwards Nozzle up to top Page 20 Is the Nozzle switch...

Page 22: ...losed Is the Nozzle switch touched Close pump Delay one second Heating arm up to top Nozzle up to top B END A NOTE Process runs from B after pressing EXIT key at any time in sucking process After clos...

Page 23: ...Nozzle switch be touched or down to bottom Is the Nozzle switch touched B Is the Nozzle switch touched Heating arm down to bottom B A Heating arm downwards Nozzle stop upwards Nozzle upwards Nozzle d...

Page 24: ...YES A B Delay one second Nozzle downwards Nozzle switch be touched or down to bottom Heating arm up to top C END Nozzle up to top Delay one second Close the pump NOTE Process runs from C after press E...

Page 25: ...ssing up and down adjusting button of the heating arm or not Delay two seconds Top temperature is bigger than T0 and up to time A Adjust the heating arm to upwards or downwards Press up and down adjus...

Page 26: ...perature is bigger than T1 and up to time A YES NO YES Control calefactive temperatureT1 T2 Top temperature is bigger than T3 and up to time NO Control calefactive temperatureT2 TL Top temperature is...

Page 27: ...re TL T3 Top temperature is bigger than T3 and up to time With sound hint or not Control constant temperature on TL T3 De solder process or not Nozzle downwards Touch the sucking switch Nozzle down to...

Page 28: ...nting delay time END Heating arm up to top No heating on top No sirocco heating on bottom Heater arm stop upwards E Note After the heating process run the process from E after sucking the chip when pr...

Page 29: ...they aren t superposition please adjust Micro adjustment Knobs of fixture until the calibration tube and hole completely superpose After superposing please don t do any change to the calibration plat...

Page 30: ...value and the calibrating parameter will be write into the process and save 4 If necessary you can repeat the above steps to calibrate once again Normally the temperature is correct not to adjust Note...

Page 31: ...the towel with cleaning oil to clean PCB fixture and orbit Replace Suction Pad If you want to replace the Suction Pad please turn off power and replace it after the vacuum suction nozzle and Top Heat...

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