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PROCESSOR TECHNOLOGY CORPORATION
Sol POWER SUPPLY
SECTION II
Rev B
NOTE
Disc capacitor leads are usually coated
with wax during the manufacturing pro-
cess.
After inserting leads through
mounting holes,
remove capacitor and
clear the holes of' any wax.
Reinsert
and install.
LOCATION
-
-
-
VALUE (ufd)
TYPE
ORIENTATION
-
-
C1
15
Tantalum
"+" lead bottom right
C2
.1
Disc
None
C3
.1
Disc
None
C6
15
Tantalum
"+"
lead right
C7
15
Tantalum
"+" lead left
Step 15.
Install 2500 ufd capacitors in locations C4 and
C5.
Bend leads to fit distance between mounting holes,
insert leads,
pull down snug to board, solder and trim.
B e
sure to install C4 with its "+"
lead to the right and C5
with its " + "
lead to the left.
step 16.
Install Q2 and Q3 (2N2222) in their locations.
The emitter lead (closest to tab on can) of Q2 is oriented
toward the left and the base lead toward the bottom.
The
emitter lead of Q3 is oriented toward the bottom and the
base lead toward the right.
Step 17.
Read assembly tip 6, on page 11-5.
Apply heat
sink compound to the inside of the small black "star-
shaped"
cooling fin,
and install it,
with the cylinderical
grip down,
on Q2 by slipping it down onto the can. Be
sure heat sink does not touch any other component on the
board.
Step 18.
Install bridge rectifier FWB 2 (MDA1O1A) in its
location at the bottom of the board.
Apply heat sink
compound, per Assembly tip 6 on page 11-5.
Position FWB2
with its "+"
lead at the top and its "-"
lead at the bottom,
insert leads,
solder and trim.
Step 19.
Install large heat sink, U1 and U3 in their loca-
tions on the bottom left corner of the circuit board.
( ) Position large black heat sink,
(flat side to board) over
the square foil area in the lower left corner of the PC
board.
Orient sink so that the two triangular cutouts in
the sink are over the two triangles of mounting holes in
the board.
( ) Position U1 (7812) on heat sink and observe how leads must
be bent to fit mounting holes.
Note that the center lead
must be bent down approximately 0.2 inches.
II-11
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