Hints for Handling
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PHYTEC Messtechnik GmbH 2011 L-710e_5
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Hints for Handling the phyCORE-i.MX27
Removal of various components, such as the microcontroller and the standard quartz, is not advisable
given the compact nature of the module. Should this nonetheless be necessary, please ensure that
the board as well as surrounding components and sockets remain undamaged while de-soldering.
Overheating the board can cause the solder pads to loosen, rendering the module inoperable.
Carefully heat neighboring connections in pairs. After a few alternations, components can be removed
with the solder-iron tip. Alternatively, a hot air gun can be used to heat and loosen the bonds.
Summary of Contents for phyCORE-i.MX27
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Page 100: ...Published by PHYTEC Messtechnik GmbH 2011 Ordering No L 710e_5 Printed in Germany ...