Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See
ABOUT LEAD FREE SOLDER (PbF: Pb free)
().
29.2. Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron
along the tips of the pins while feeding enough solder to the tip so
that it flows under the pins as they are heated.
29.3. Modification Procedure of Bridge
69
Summary of Contents for KX-TCD410ALM
Page 21: ... To exit the operation press any time 21 ...
Page 48: ...18 FREQUENCY TABLE MHz 48 ...
Page 55: ...25 CPU DATA BASE UNIT 25 1 IC2 BBIC 55 ...
Page 71: ...71 ...
Page 73: ...73 ...
Page 74: ...33 ACCESSORIES AND PACKING MATERIALS 33 1 KX TCD410ALM ALS 33 2 KX TCD412ALM ALS 74 ...
Page 75: ...33 3 KX A142ALM ALS 75 ...
Page 76: ...34 TERMINAL GUIDE OF THE ICs TRANSISTORS AND DIODES 34 1 Base Unit 76 ...
Page 104: ...Clip Base PCB G N D S D A S C L 2 7V MODE SDA SCLK GND J104 J103 J102 J101 J100 ...
Page 106: ...PbF IC1 IC2 80 30 50 5 8 4 1 1 11 18 1 IC3 Marked ...
Page 108: ...4 1 5 8 PbF 1 28 18 IC3 IC2 IC1 11 64 1 16 17 32 49 48 33 Marked ...