Oracle X7-2L, Service Manual

Page: 200 / 308

Remove the Motherboard Assembly
b.
Extend the server into the maintenance position.
See “Extend the Server to the Maintenance Position” on page 60 .
c. Attach an antistatic wrist strap to your wrist, and then to a metal area of the
chassis.
See “Take Antistatic Measures” on page 62 .
d.
Remove the server top cover.
See “Remove the Server Top Cover” on page 63 .
2. If present, remove the Oracle Storage 12 Gb SAS PCIe RAID HBA , Internal card
and its associated super capacitor.
See “Remove the Internal HBA Card and HBA Super Capacitor” on page 180 .
Note -
After you remove the HBA super capacitor, remove the HBA super capacitor tray by
squeezing the plastic hinges together and lifting the tray from the chassis.
3. Remove the following reusable components:
Caution -
During the motherboard removal procedure, it is important to label power supplies
with the slot numbers from which they were removed (PS0, PS1). This is required because the
power supplies must be reinstalled into the slots from which they were removed; otherwise, the
server key identity properties (KIP) data might be lost. When a server requires service, the KIP
is used by Oracle to verify that the warranty on the server has not expired. For more information
on KIP, see “FRU Key Identity Properties (KIP) Automated Update” on page 51 .
■
Fan modules
See
“Remove a Fan Module” on page 85 .
■
Fan tray
See
“Remove the Fan Tray” on page 89 .
■
Air baffle
See
“Remove the Air Baffle” on page 111 .
■
PCIe cards
See
“Remove a PCIe Card” on page 133 .
■
SAS storage drive cables (if present)
See
“Remove SAS Storage Drive Cables” on page 187 .
■
NVMe cables (if present)
200 Oracle Server X7-2L Service Manual • October 2017