www.okinternational.com
- 7 -
P/N 7000-1370, Revision B
When operating this equipment, please exercise caution. If this unit is used in
a manner, which it is not intended for
,
serious personal injury may occur.
Please read this operators manual thoroughly prior to use.
After accurate component placement is achieved, the vacuum pickup tube is
automatically retracted and the reflow nozzle is lowered into place. At this point, the
component is subjected to a 5 zone, full convection reflow profile, specifically tailored to
the requirements of that particular PCB, device and solder paste. Accurate duplication
of original oven reflow parameters is achieved.
During the course of the reflow profile, source temperatures and time intervals can be
modified “On the Fly”, eliminating the need to wait for the current profile to terminate
before modifications can be made. Precise solder joint temperatures are measured and
displayed on a real time graphical display, thus providing the necessary data to
accurately and easily establish the optimum reflow profile for each particular application
within minutes.
II. SYSTEM FEATURES AND ACCESSORIES
APR-5000 SYSTEM INCLUDES:
1. APR-5000 Series Base Unit
2. Adjustable size board holder
3. APR-5000 Accessory Kit (APR-5AK)
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