www.okinternational.com
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P/N 7000-1370, Revision B
9. “Hit action buttons to lower reflow head to set nozzle height.” Fine adjust nozzle
height using computer screen buttons or APR-5000 manual keys.. Click Next
10. Select Next and then click Start to begin the profile.
11. When profile is completed. Click Next
12. “Hit action buttons to move head to home position.”
13. Save Saves graphics as a .DAT file.
14. Click “Finish” to complete process.
Process Set Up – New Process- Placement
1. Click on “process set up”
2. Click on “Placement only”
3. Click on “new process” and enter chip package information.
4. “Attach Vacuum Cup” and Reflow Nozzle.
1. Yes – Enter the vacuum cup part number.
2. No
Click Next
Attach Reflow Nozzle during process?
•
Yes – Enter the Nozzle part number.
•
No
Click Next
5. Camera – Pull out camera to continue.
Click Next
6. Select Component Pick-up Method.
Click Next
7. Component – Set the height and the method for picking up the component.
•
Component Pick Up – This mode picks up the part for a placement onto a
previously prepared board.
•
Component Pick Up with Paste – This mode picks up a component that has been
stenciled with solder paste for placement onto the PCB.
•
Component Pick Up with Flux Dip – This mode picks up of a component and
allows the additional steps required to dip the part into a dip transfer plate.
Click Next
8. Screen Prompt “hit action buttons to return head to home position.”
Click Next
9. Screen Prompt “remove the centering fixture from the camera housing” Select
Next to continue.
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