www.okinternational.com
- 39 -
P/N 7000-1370, Revision B
thermal demand of the assembly that is being reworked. For more information on OK
International Smart Heat™ Technology, please contact your local Metcal representative
or visit
www.okinternational.com
for more information.
The following blade style tips are available for the MX-500 Series Rework System:
SMTC-x60 (.410” length)
SMTC-x62
(.870”
length)
SMTC-x61 (.620” length)
SMTC-x110
(1.55”
length)
Please note that “x” denotes tip temperature. All cartridges are available in 500, 600 and
700 series styles. (5 = 500°F, 0=600°F and 1=700°F).
As an option you can utilize a vacuum desoldering system such as the SP-440 Self-
Contained Desoldering System or MX-500DS Shop-Air Desolder / Solder Rework
System to vacuum residual solder from the PCB.
NOTE ON CLEANING:
Although isopropyl rubbing alcohol and cotton swab work satisfactory for removing flux
residue, it is strongly recommended you contact your solder paste manufacturer for
recommendations for cleaning the residue left by their products.
SOLDER PASTE DEPOSITION and FLUX APPLICATION
Component Stenciling Templates
The application of new solder paste or flux directly to the component’s solder balls can
be accomplished with OK International Component Stenciling Templates. The templates
allow the precise application of solder paste without concern for surrounding parts on
your PCB. Since the component is pasted rather than the board, operators find this to
be a much faster and simpler solution. Please contact your local representative for
information and availability. Custom sizes and styles are available.
Solder Paste Application using the Component Stenciling Templates:
1. Select the correct solder paste plate for your component and application.
2. Position the component onto the component side of the plate (the side with the
smaller cut out or etched component corners.)
3. Secure the component with the supplied clamp assembly. Please be careful not
to over-tighten the clamp as this can cause the plate to bend which will affect
print quality.
4. Apply solder paste to the solder balls using the supplied spatula. When printing,
make sure the stencil face remains clean after your print, this ensures correct
solder paste volume.
5. Carefully remove the component clamp assembly and position the solder paste
plate onto the component pick up plate aligning it with the two tooling pins.
6. Using the vacuum pipette lift the component from the solder paste plate and
continue with your alignment process.
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