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LPC5411x
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Product data sheet
Rev. 2.1 — 9 May 2018
96 of 105
NXP Semiconductors
LPC5411x
32-bit ARM Cortex-M4/M0+ microcontroller
Fig 39. LQFP64 Soldering footprint
SOT314-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP64 package
Ax
Bx
Gx
Gy
Hy
Hx
Ay
By
P1
P2
D2 (8x)
D1
(0.125)
Ax
Ay
Bx
By
D1
D2
Gx
Gy
Hx
Hy
13.300 13.300 10.300 10.300
P1
0.500
P2
0.560
0.280
C
1.500
0.400
10.500 10.500 13.550 13.550
sot314-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout