NSW-5
System Module UT5U
PAMS Technical Documentation
Page 56
Issue 1 10/00
Nokia Mobile Phones Ltd.
C923
2320941 Ceramic cap.
10 V 0402
C924
2320744 Ceramic cap.
1.0 n
10 % 50 V 0402
C925
2320524 Ceramic cap.
3.3 p
0.25 % 50 V 0402
C927
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C928
2320524 Ceramic cap.
3.3 p
0.25 % 50 V 0402
C931
2320522 Ceramic cap.
2.7 p
0.25 % 50 V 0402
C932
2320501 Ceramic cap.
50 V 0402
C934
2320546 Ceramic cap.
27 p
5 % 50 V 0402
C937
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C938
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C939
2320546 Ceramic cap.
27 p
5 % 50 V 0402
C941
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C943
2320546 Ceramic cap.
27 p
5 % 50 V 0402
C949
2320522 Ceramic cap.
2.7 p
0.25 % 50 V 0402
C954
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C955
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C961
2320536 Ceramic cap.
10 p
5 % 50 V 0402
C962
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C963
2320778 Ceramic cap.
10 n
10 % 16 V 0402
C965
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C966
2320744 Ceramic cap.
1.0 n
10 % 50 V 0402
C968
2320921 Ceramic cap.
3.9 p
5 % 16 V 0402
C969
2320552 Ceramic cap.
47 p
5 % 50 V 0402
C970
2320530 Ceramic cap.
5.6 p
0.25 % 50 V 0402
C972
2320131 Ceramic cap.
33 n
10 % 16 V 0603
C981
2320530 Ceramic cap.
5.6 p
0.25 % 50 V 0402
C982
2320560 Ceramic cap.
100 p
5 % 50 V 0402
C984
2320540 Ceramic cap.
15 p
5 % 50 V 0402
C992
2320546 Ceramic cap.
27 p
5 % 50 V 0402
C999
2320903 Ceramic cap.
2.7 p
5 % 16 V 0402
L150
3203735 Ferrite bead 30r/100mhz 0805
0805
L701
3643007 Chip coil
18 n
5 % Q=30/250 MHz
0805
L702
3645063 Chip coil
270 n
5 % Q=48/250 MHz
0805
L703
3640045 Chip coil
10.Q n
5 % Q=55/750 MHz
0805
L705
3641622 Chip coil
220 n
5 % Q=30/100 MHz
0805
L721
3641521 Chip coil
6. Q n
5 % Q=50/250 MHz
0805
L723
3645147 Chip coil
100 n
5 % Q=12/100 MHz
0603
L724
3608407 Chip coil
470 n
5 % 1206
L740
3645231 Chip coil
39.Q n
5 % Q=40/250 MHz
0603
L741
3641620 Chip coil
180 n
5 % Q=35/100 MHz
0805