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DS3171/DS3172/DS3173/DS3174
219
16 PACKAGE THERMAL INFORMATION
The 36 thermal V
SS
balls in the center 6X6 matrix must be thermally and electrically connected to the
internal GND plane of the PC board to achieve these thermal characteristics.
PARAMETER
VALUE
Target Ambient Temperature Range
-40°C to +85°C
Die Junction Temperature Range
-40 to +125
°
C
Theta-JA, Still Air
12.6
°
C/W (Note 1)
Note 1:
Theta-JA is based on the package mounted on a 4-layer JEDEC board
and measured in a JEDEC test chamber.