Platform Description
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Intel® Server Platforms SR6850HW4 and SR6850HW4/M Product Guide
Cooling Subsystem
CAUTION
The chassis top cover must be installed for proper system cooling. Cooling
components must be hot-swapped within a limited time. This time applies
only to the time that the cooling component is physically removed, not from
the time of failure.
The cooling subsystem consists of hot-swap, redundant (5+1) fans and the fans in the power supply
modules. In the event of a cooling component failure, system cooling is maintained and the system
continues to operate while the component is being hot-swapped. Each fan has a single LED to
indicate its status. The LED will illuminate green while the fan is operating normally. The LED will
illuminate amber if the fan has failed. Failed fans can be hot-swapped from the top of the chassis
once the top cover is removed.
TP01492
Figure 8. System Fan LED Indicator
The processor heatsink baffle must always be in place. Systems that are not fully configured with
four processors and four memory boards must keep the processor heatsink and memory board
fillers installed to maintain proper cooling.
