Intel®
Server System SR1625UR TPS
Cooling Subsystem
Revision 1.5
Intel order number E47487-007
29
Figure 18. Power Supply Air Duct
4.2.2
PCI Riser Zone
The PCI riser zone is the area between the power supply assembly and the PCI riser card of
the riser assembly. The airflow through this area is generated by Fan 5 of the fan module. Air is
drawn from the drive bay area through the fan and pushed out of the system through ventilation
holes at the back of the chassis.
4.2.3
CPU/Memory
The CPU/memory zone is the area between the PCI riser card of the riser assembly and the
right chassis wall. The airflow for this zone is generated by system fans 1, 2, 3, and 4 of the fan
module. Air is drawn from the drive bay area, through the fans, directed through the CPU air
duct, and out through ventilation holes on both the back wall and rear side wall of the chassis.
An air duct is used to direct airflow through the processor heatsinks for both single and dual
processor configurations.
Note: The air baffle should ONLY be removed when a second processor is installed. Operating
a single processor configuration with the air baffle removed may overheat the processor and
may cause the system to shut down.
