Cooling Subsystem
Intel®
Server System SR1625UR TPS
26
Revision 1.5
Intel order number E47487-007
4.
Cooling Subsystem
Several components and configuration requirements make up the cooling subsystem. These
include the system fan module, the power supply fans, power supply air duct, CPU air duct,
DIMM blanks, and drive bay population. All are necessary to provide and regulate the airflow
and air pressure needed to maintain the system’s thermals when operating at or below
maximum specified thermal limits.
The system has a redundant system cooling configuration consisting of five 40x40x56-mm dual-
rotor system fans. This configuration provides sufficient airflow to maintain internal system
thermal requirements when a single fan rotor fails and when the external ambient temperature
remains within specified limits. The fans are not hot-swappable and the system must be shut
down in order to replace a failed fan.
In addition to the system fans, each installed power supply module provides an additional 56-
mm dual-rotor fan, which pulls air from inside the system and blows it out the back.
The system utilizes an integrated platform control mechanism to manage a variable fan speed
control engine to provide adequate cooling for the system. If a fan fails, the Integrated BMC
boosts the remaining fans as a means to compensate for the lost airflow. If the cooling is not
sufficient under a failed fan condition, the system eventually shuts down to protect itself from
thermal damage. Additionally, this fan boost causes additional vibration in this system. Some
hard drives are very susceptible to vibration. For additional details, see Section 4.5.
4.1
Fan Module
The system fan module houses five 40x40x56-mm dual-rotor system fans. The module has
been designed for ease of use and has support for several management features that can be
utilized by the Integrated Baseboard Management Controller. The system fan module and
individual dual-rotor fans do not require tools for installation or removal.
Figure 16. Fan Module
