Intel® Server Board SE7505VB2
Hardware Monitoring
6. Hardware
Monitoring
6.1 Monitored
Components
The Intel Server Board SE7505VB2 has an integrated Winbond* Heceta chip that is responsible
for hardware monitoring. The Winbond Heceta chip provides basic server hardware monitoring
which alerts a system administrator if a hardware problem occurs on the board. The retail boxed
board
ships with a copy of LANDesk* Client Manager, which can monitor the management bus
for these alerts and help administrators identify a problem on the board. Below is a table of
monitored headers and sensors on the board.
Table 18. Monitored Components
Item
Description
Voltage
Vcpu
Monitors processor voltage
(sIO)
1.8V
Monitors
+1.8V
(sIO)
3.3V
Monitors
+3.3V
(sIO)
5V
Monitors 5VSB (Internal)
(sIO)
SB3V
Monitors
+12Vin
(sIO)
ENG12V
Monitors –12Vin (should be same as 12V @ Power-Supply)
(sIO)
2.5V
Monitors
–5V
(sIO)
Vbat
Monitors battery voltage
(sIO)
SB5V
Monitors
5VSB
(sIO)
Fan Speed
PWM1
Controls system fans
(sIO)
CPU fans (invariable speed)
(sIO)
TACH1
Monitors system fan 1 (front)
(sIO)
TACH2
Monitors system fan 2 (front)
(sIO)
TACH3
Monitors system fan 4 (rear)
(sIO)
TACH4
Monitors system fan 3 (rear)
(sIO)
TACH5
Monitors CPU fan 2
(sIO)
TACH6
Monitors CPU fan 1
(sIO)
Temperature CPU0
Monitors
primary processor temperature
(sIO)
CPU1
Monitors secondary processor temperature
(sIO)
Ambient
Monitors Ambient temperature
(sIO)
The LANDesk Client Manager software and a white paper that provides more information on
using LDCM are available on the
Intel
Server Board SE7505VB2 Resource CD.
Revision 1.2
Intel part number C32194-002
45
