Intel® Server System M20NTP1UR - System Integration and Service Guide
52
5.3
Support Requirements for Thermal Management
How the system manages heat is critical to system performance and long-term reliability. The system is
designed to operate at external ambient air temperatures ranging between 10°C and 35°C. The system must
maintain a steady air flow through the system to expel all hot air generated within it. Using six system fans,
an embedded fan within each installed power supply, and other system components, the system pulls cool
air in from the front, channels it over and through several high heat generating components and areas within
the chassis, and then pushes the hot air out the back
Figure 53. System Airflow
To ensure enough cool air is pulled in and directed to the high heat areas within the system, the following
requirements must be followed while the system is operational.
•
External ambient air in front of the system is between 10°C and 35°C
•
The system top cover must be installed
•
The system air duct must be installed
•
All front drive bays must be populated with an SSD/HDD or supplied drive blank
•
All memory slots must be populated with a DIMM or supplied DIMM blank. A DIMM blank should only
be removed when replacing it with a DIMM.
Figure 54. DIMM Blank
•
Minimize airflow blockage within the chassis by routing internal cables along the left chassis side wall
and the base of the power supply cage. Other than the system fan cables and CPU power cables, no
other cables should be routed in front of the system fan assembly.
Reference the
Intel® Server System M20NTP1UR Technical Product Specification
for the latest Thermal
Configuration support tables.
10°C
to
35° C **
Ambient In
Hot
Out
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