Intel Intel E7230 MCH, Thermal/Mechanical Design Manual

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4 Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
Figures
2-1 MCH Package Dimensions (Top View) ................................................................. 9
2-2 MCH Package Dimensions (Side View) .............................................................. 10
2-3 MCH Package Dimensions (Bottom View).......................................................... 10
5-1 Thermal Solution Decision Flowchart.................................................................. 18
5-2 Zero Degree Angle Attach Heatsink Modifications.............................................. 18
5-3 Zero Degree Angle Attach Methodology (Top View)........................................... 18
6-1 Plastic Wave Soldering Heatsink Measured Thermal Performance
versus Approach Velocity.................................................................................... 22
6-2 Plastic Wave Soldering Heatsink Volumetric Envelope for the Chipset MCH..... 23
6-3 Plastic Wave Soldering Heatsink Board Component Keepout ........................... 24
6-4 Retention Mechanism Component Keepout Zones ........................................... 25
6-5 Plastic Wave Soldering Heatsink Assembly ....................................................... 26
6-6 Plastic Wave Soldering Heatsink Extrusion Profile ............................................ 27
B-1 Plastic Wave Soldering Heatsink Assembly Drawing ......................................... 32
B-2 Plastic Wave Soldering Heatsink Drawing (1 of 2).............................................. 33
B-3 Plastic Wave Soldering Heatsink Drawing (2 of 2).............................................. 34
B-4 Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2) ............................ 35
B-5 Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2) ............................ 36
B-6 Plastic Wave Soldering Heatsink Wire Clip Drawing .......................................... 37
B-7 Plastic Wave Soldering Heatsink Solder-down Anchor Drawing ........................ 38
Tables
3-1 Intel® E7230 Chipset MCH Thermal Specifications............................................ 13
6-1 Chomerics T710 TIM Performance as a Function of Attach Pressure ............... 27
6-2 Reliability Guidelines ........................................................................................... 28
B-1 Mechanical Drawing List ..................................................................................... 31