Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
13
3
Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to consume
maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more
realistic power level for thermal design purposes, Intel characterizes power consumption based on
known platform benchmark applications. The resulting power consumption is referred to as the
Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be
designed to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see
Table 3-1
for the Intel E7230 chipset MCH. FC-BGA packages have
poor heat transfer capability into the board and have minimal thermal capability without a thermal
solution. Intel recommends that system designers plan for a heatsink when using the Intel E7230
chipset.
3.2
Die Case Temperature
To ensure proper operation and reliability of the Intel E7230 chipset MCH, the die temperatures
must be at or between the maximum/minimum operating temperature ranges as specified in
Table 3-1
. System and/or component level thermal solutions are required to maintain these
temperature specifications. Refer to
Section 5
for guidelines on accurately measuring package die
temperatures.
Note:
These specifications are based on silicon characterization; however, they may be updated as further
data becomes available.
§
Table 3-1. Intel
®
E7230 Chipset MCH Thermal Specifications
Parameter
Value
Notes
T
case_max
105°C
T
case_min
5°C
TDP
dual channel
10.6 W
DDR2-533
TDP
dual channel
12.7 W
DDR2-667
