Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
7
1
Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to
improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
•
Outline the thermal and mechanical operating limits and specifications for the Intel
®
E7230
chipset memory controller hub (MCH).
•
Describe a reference thermal solution that meets the specification of the Intel
®
E7230 chipset
MCH.
Properly designed thermal solutions provide adequate cooling to maintain the Intel E7230 chipset
MCH die temperatures at or below thermal specifications. This is accomplished by providing a low
local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-
ambient thermal resistance. By maintaining the Intel E7230 chipset MCH die temperature at or
below the specified limits, a system designer can ensure the proper functionality, performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance
and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling
is required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.
This document addresses thermal design and specifications for the Intel E7230 chipset MCH
components only. For thermal design information on other chipset components, refer to the
respective component datasheet. For the PXH, refer to the
Intel
®
6700PXH 64-bit PCI Hub/
6702PXH 64-bit PCI Hub (PXH/PXH-V) Thermal/Mechanical Design Guidelines
. For the ICH7,
refer to the
Intel
®
I/O Controller Hub 7 (ICH7) Thermal Design Guidelines
.
Note:
Unless otherwise specified, the term “MCH” refers to the Intel E7230 chipset MCH.
1.1
Definition of Terms
BGA
Ball grid array. A package type, defined by a resin-fiber substrate, onto
which a die is mounted, bonded and encapsulated in molding compound.
The primary electrical interface is an array of solder balls attached to the
substrate opposite the die and molding compound.
BLT
Bond line thickness. Final settled thickness of the thermal interface
material after installation of heatsink.
MCH
Memory controller hub. The chipset component that contains the
processor interface, the memory interface, the PCI Express* interface
and the DMI interface.
PXH
Intel
®
6700PXH 64-bit PCI Hub. The chipset component that performs
PCI bridging functions between the PCI Express interface and the PCI
