Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
3
Contents
1
Introduction.........................................................................................................................7
1.1
Definition of Terms ................................................................................................7
1.2
Reference Documents........................................................................................... 8
2
Packaging Technology ....................................................................................................... 9
2.1
Package Mechanical Requirements.................................................................... 11
3
Thermal Specifications ..................................................................................................... 13
3.1
Thermal Design Power (TDP) ............................................................................. 13
3.2
Die Case Temperature ........................................................................................ 13
4
Thermal Simulation .......................................................................................................... 15
5
Thermal Metrology ........................................................................................................... 17
5.1
Die Temperature Measurements......................................................................... 17
5.1.1
Zero Degree Angle Attach Methodology ................................................ 17
5.2
Power Simulation Software ................................................................................. 19
6
Reference Thermal Solution............................................................................................. 21
6.1
Operating Environment ....................................................................................... 21
6.2
Heatsink Performance......................................................................................... 21
6.3
Mechanical Design Envelope .............................................................................. 22
6.4
Board-Level Components Keepout Dimensions ................................................. 23
6.5
Plastic Wave Soldering Heatsink Thermal Solution Assembly............................ 24
6.5.1
Heatsink Orientation ............................................................................... 25
6.5.2
Extruded Heatsink Profiles ..................................................................... 26
6.5.3
Mechanical Interface Material ................................................................26
6.5.4
Thermal Interface Material ..................................................................... 26
6.5.5
Heatsink Clips ........................................................................................ 27
6.5.6
Clip Retention Anchors........................................................................... 28
6.6
Reliability Guidelines ........................................................................................... 28
A
Thermal Solution Component Suppliers...........................................................................29
A.1
Plastic Wave Soldering Heatsink Thermal Solution ............................................ 29
B
Mechanical Drawings ....................................................................................................... 31
