Thermal Metrology
18
Intel
®
E7230 Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide
NOTE:
Not to scale.
NOTE:
Not to scale.
Figure 5-1. Thermal Solution Decision Flowchart
001240
A ttac h
therm ocouples
using rec om m ended
m etrology. S etup
the s ys tem in the
desired
configuration.
T die >
S pecification?
N o
Y es
H eatsink
R equired
S elect
H eatsink
E nd
S tart
R un the P ower
program and
m onitor the
devic e die
tem perature.
A ttac h devic e
to board
using norm al
reflow
proc ess .
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Thermocouple Bead
Die
Thermocouple
Wire
Substrate
