Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008
TDG
Order Number: 320028-001
30
Mechanical Drawings—Core™ 2 Duo Mobile Processors
Appendix B Mechanical Drawings
Table 6
lists the mechanical drawings included in this appendix.
Table 6.
Mechanical Drawings
Description
Figure
AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
Figure 15
AdvancedTCA* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
Figure 16
AdvancedTCA* Reference Heatsink Assembly
Figure 17
AdvancedTCA* Reference Heatsink
Figure 18
CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 1 of 2)
Figure 19
CompactPCI* Reference Heatsink PCB Keep Out Zone Requirements (Sheet 2 of 2)
Figure 20
CompactPCI* Reference Heatsink Assembly
Figure 21
CompactPCI* Reference Heatsink
Figure 22
1U Reference Heatsink PCB Keep Out Requirements (Sheet 1 of 2)
Figure 23
1U Reference Heatsink PCB Keep Out Requirements (Sheet 2 of 2)
Figure 24
1U Reference Heatsink Assembly
Figure 25
1U Reference Heatsink
Figure 26
