Core™ 2 Duo Mobile Processors—Thermal Solution Component Suppliers
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
29
Order Number: 320028-001
Appendix A Thermal Solution Component Suppliers
These vendors and devices are listed by Intel as a convenience to Intel’s general customer base. Intel
does not make any representations or warranties whatsoever regarding quality, reliability,
functionality, or compatibility of these devices. This list and/or these devices may be subject to
change without notice.
Note:
The enabled components may not be currently available from all suppliers. Contact the
supplier directly to verify availability.
Table 5.
Reference Heatsink
Part
Part Number
Contact Information
AdvancedTCA* passive heatsink assembly
ECC-00177-01-GP
Cooler Master*
Wendy Lin
(510)770-8566 ext 211
1U+ passive heatsink assembly
ECC-00179-01-GP
cPCI passive heatsink assembly
ECC-00178-01-GP
Thermal Interface Material
PCM45F
Honeywell*
Paula Knoll
(858) 279-2956
