Core™ 2 Duo Mobile Processors—Reference Thermal Solutions
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
23
Order Number: 320028-001
Thermal interface materials have thermal impedance (resistance) that will increase as the material
degrades over time. It is important for thermal solution designers to take this increase in impedance
into consideration when designing a thermal solution. It is recommended that system integrators
work with TIM suppliers to determine the performance of the desired thermal interface material. If
system integrators wish to maintain maximum thermal solution performance, the TIM could be
replaced during standard maintenance cycles.
The reference thermal solution uses Shin Etsu* G751. Alternative materials can be used at the user’s
discretion. Regardless, the entire heatsink assembly, including the heatsink, and TIM (including attach
method), must be validated together for specific applications.
6.8
Heatsink Orientation
All of the heatsinks were designed to maximize the available space within the volumetric keep out
zone and their respective form factor limitations. These heatsinks must be oriented in a specific
direction relative to the processor keep out zone and airflow. In order to use these designs, the
processor must be placed on the PCB in an orientation so the heatsink fins will be parallel to the
airflow.
Figure 12
illustrates this orientation.
Figure 12.
Heatsink Orientation Relative to Airflow Direction
