Core™ 2 Duo Mobile Processors—Thermal Solution Requirements
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
17
Order Number: 320028-001
It is evident from the above calculations that a reduction in the local ambient temperature can have a
significant effect on the junction-to-ambient thermal resistance requirement. This effect can
contribute to a more reasonable thermal solution including reduced cost, heatsink size, heatsink
weight, or a lower system airflow rate.
Table 3
summarizes the thermal budget required to adequately cool the Intel® Core™ 2 Duo Mobile
Processors on 45-nm process. Since the data is based on air data at sea level, a correction factor
would be required to estimate the thermal performance at other altitudes.
Table 3.
Required Heatsink Thermal Performance (
Ψ
JA
)
CPU
Processor SKU
TDP
(W)
Ψ
JA
(ºC/W)
at T
A
= 40 ºC
Ψ
JA
(ºC/W)
at T
A
= 55 ºC
Intel® Core™ 2 Duo
Mobile Processors on 45-
nm process
Standard Voltage
(Core 2 Duo-6M,
Celeron-2M)
35
1.86
1.42
Low Voltage
(Core 2 Duo -3M)
17
3.82
2.94
Ultra Low Voltage
(Core 2 Duo -2M,
Celeron)
10
6.5
5.0
Notes:
1.
T
A
is defined as the local (internal) ambient temperature measured approximately 1 inch upstream
from the device.
