Intel® Core™ 2 Duo Mobile Processors on 45-nm process for Embedded Applications
June 2008
TDG
Order Number: 320028-001
28
Reliability Guidelines—Core™ 2 Duo Mobile Processors
8.0
Reliability Guidelines
Each motherboard, heatsink, and attach combination may vary the mechanical loading of the
component. The user should carefully evaluate the reliability of the completed assembly prior to use
in high volume. Some general recommendations are shown in
Table 4
.
Table 4.
Reliability Requirements
Test
1
Requirement
Pass/Fail Criteria
2
Mechanical Shock
50 g, board level, 11 msec, 3 shocks/axis
Visual Check and Electrical
Functional Test
Random Vibration
7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz
Visual Check and Electrical
Functional Test
Temperature Life
85 °C, 2000 hours total, checkpoints at 168, 500,
1000, and 2000 hours
Visual Check
Thermal Cycling
-5 °C to +70 °C, 500 cycles
Visual Check
Humidity
85% relative humidity, 55 °C, 1000 hours
Visual Check
Notes:
1.
The above tests should be performed on a sample size of at least 12 assemblies from three lots of
material.
2.
Additional pass/fail criteria may be added at the discretion of the user.
