Core™ 2 Duo Mobile Processors—Contents
Intel® Core™ 2 Duo Mobile Processors on 45-nm process-Thermal Design Guide
TDG
June 2008
3
Order Number: 320028-001
Contents
1.0
Introduction ............................................................................................................. 6
1.1
Design Flow ....................................................................................................... 6
1.2
Definition of Terms ............................................................................................. 7
1.3
Reference Documents.......................................................................................... 8
1.4
Thermal Design Tool Availability ........................................................................... 8
2.0
Package Information ................................................................................................ 9
3.0
Thermal Specifications.............................................................................................10
3.1
Thermal Design Power........................................................................................10
3.2
Maximum Allowed Component Temperature ..........................................................10
4.0
Mechanical Specifications ........................................................................................11
4.1
Package Mechanical Requirements .......................................................................11
4.1.1
Die Pressure/Load Upper Limit..................................................................11
4.1.2
Die Pressure/Load Lower Limit..................................................................11
4.2
Package Keep Out Zones Requirements ................................................................11
4.3
Board Level Keep Out Zone Requirements.............................................................11
5.0
Thermal Solution Requirements ...............................................................................15
5.1
Thermal Solution Characterization........................................................................15
5.1.1
Calculating the Required Thermal Performance for the Intel
®
Core™2 Duo
processor ..............................................................................................16
6.0
Reference Thermal Solutions ...................................................................................18
6.1
ATCA Reference Thermal Solution ........................................................................18
6.2
Keep Out Zone Requirements ..............................................................................19
6.3
Thermal Performance .........................................................................................19
6.4
1U+ Reference Heatsink .....................................................................................19
6.4.1
Keep Out Zone Requirements ...................................................................20
6.4.2
Thermal Performance ..............................................................................20
6.5
Compact PCI Reference Heatsink .........................................................................21
6.5.1
Keep Out Zone Requirements ...................................................................22
6.5.2
Thermal Performance ..............................................................................22
6.6
Heatsink Fastener Assembly................................................................................22
6.7
Thermal Interface Material (TIM) .........................................................................22
6.8
Heatsink Orientation ..........................................................................................23
7.0
Thermal Metrology...................................................................................................24
7.1
Die Temperature Measurements ..........................................................................24
7.2
Power Simulation Software .................................................................................24
7.3
Additional Thermal Features ................................................................................24
7.4
Local Ambient Temperature Measurement Guidelines..............................................24
7.4.1
Active Heatsink Measurements .................................................................25
7.4.2
Passive Heatsink Measurements................................................................25
8.0
Reliability Guidelines ...............................................................................................28
A
Thermal Solution Component Suppliers....................................................................29
B
Mechanical Drawings ...............................................................................................30
