Document Number: 318080-002
93
Signal Definitions
SMI#
I
SMI# (System Management Interrupt) is asserted asynchronously by system logic.
On accepting a System Management Interrupt, processors save the current state and
enter System Management Mode (SMM). An SMI Acknowledge transaction is issued,
and the processor begins program execution from the SMM handler.
If SMI# is asserted during the deassertion of RESET# the processor will tri-state its
outputs. See
Section 7.1
.
STPCLK#
I
STPCLK# (Stop Clock), when asserted, causes processors to enter a low power Stop-
Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops
providing internal clock signals to all processor core units except the FSB and APIC
units. The processor continues to snoop bus transactions and service interrupts while
in Stop-Grant state. When STPCLK# is deasserted, the processor restarts its internal
clock to all units and resumes execution. The assertion of STPCLK# has no effect on
the bus clock; STPCLK# is an asynchronous input.
TCK
I
TCK (Test Clock) provides the clock input for the processor Test Bus (also known as
the Test Access Port).
TDI
I
TDI (Test Data In) transfers serial test data into the processor. TDI provides the serial
input needed for JTAG specification support.
TDO
O
TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the
serial output needed for JTAG specification support.
TESTHI[1:0]
I
TESTHI[1:0] must be connected to a V
tt
power source through a resistor for proper
processor operation. Refer to
Section 2.5
for TESTHI grouping restrictions.
TESTIN1
TESTIN2
I
I
TESTIN1 must be connected to a VTT power source through a resistor as well as to
the TESTIN2 pin of the same socket for proper processor operation.
TESTIN2 must be connected to a VTT power source through a resistor as well as to
the TESTIN1 pin of the same socket for proper processor operation.
Refer to
Section 2.5
for TESTIN restrictions.
THERMTRIP#
O
Assertion of THERMTRIP# (Thermal Trip) indicates the processor junction
temperature has reached a temperature beyond which permanent silicon damage
may occur. Measurement of the temperature is accomplished through an internal
thermal sensor. Upon assertion of THERMTRIP#, the processor will shut off its internal
clocks (thus halting program execution) in an attempt to reduce the processor
junction temperature. To protect the processor, its core voltage (V
CC
) must be
removed following the assertion of THERMTRIP#. See
Figure 2-21
and
Table 2-22
for
the appropriate power down sequence and timing requirements. Intel also
recommends the removal of V
TT
when THERMTRIP# is asserted.
Driving of the THERMTRIP# signals is enabled within 10
μ
s of the assertion of
PWRGOOD and is disabled on de-assertion of PWRGOOD. Once activated,
THERMTRIP# remains latched until PWRGOOD is de-asserted. While the de-assertion
of the PWRGOOD signal will de-assert THERMTRIP#, if the processor’s junction
temperature remains at or above the trip level, THERMTRIP# will again be asserted
within 10
μ
s of the assertion of PWRGOOD.
TMS
I
TMS (Test Mode Select) is a JTAG specification support signal used by debug tools.
See the XDP: Debug Port Design Guide for Intel® 7300 Chipset Platforms for further
information.
TRDY#
I
TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive
a write or implicit writeback data transfer. TRDY# must connect the appropriate pins
of all FSB agents.
TRST#
I
TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven
low during power on Reset.
V
CCPLL
I
The Intel
®
Xeon
®
Processor 7200 Series and 7300 Series implement an on-die PLL
filter solution. The V
CCPLL
input is used as a PLL supply voltage.
VCC_SENSE
VCC_SENSE2
O
VCC_SENSE and VCC_SENSE2 provides an isolated, low impedance connection to the
processor core power and ground. These signals should be used to provide feedback
to the voltage regulator signals, which ensure the output voltage (that is, processor
voltage) remains within specification. Please see the applicable platform design guide
for implementation details.
Table 5-1.
Signal Definitions (Sheet 7 of 8)
Name
Type
Description
Notes
Summary of Contents for BFCBASE - Motherboard - 7300
Page 14: ...Introduction 14 Document Number 318080 002 ...
Page 56: ...Electrical Specifications 56 Document Number 318080 002 ...
Page 65: ...Document Number 318080 002 65 Mechanical Specifications Figure 3 8 Volumetric Height Keep Ins ...
Page 70: ...Mechanical Specifications 70 Document Number 318080 002 ...
Page 86: ...Pin Listing 86 Document Number 318080 002 ...
Page 138: ...Features 138 Document Number 318080 002 ...
Page 140: ...Boxed Processor Specifications 140 Document Number 318080 002 ...
