Thermal Specifications
98
Document Number: 318080-002
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in
Section 2
.
2.
Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
5.
Power specifications are defined at all VIDs found in
Table 2-3
. The Intel® Xeon® X7350 Processor may be
shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to
Table 6-4
for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC
activation and may incur measurable performance loss. (See
Section 6.2
for details on TCC activation).
3.
Refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300
Series Thermal / Mechanical Design Guide for system and environmental implementation details.
Table 6-3.
Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
130
5
See
Figure 6-2
;
Table 6-4
;
1, 2, 3, 4, 5, 6
Figure 6-2.Quad-Core Intel® Xeon® X7350 Processor Thermal Profile
Therm al Profile
20.00
30.00
40.00
50.00
60.00
70.00
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Po w er ( W )
T
e
m
p
er
at
u
re (
C
)
T
case
= 0.162 x Pow er + 45
Summary of Contents for BFCBASE - Motherboard - 7300
Page 14: ...Introduction 14 Document Number 318080 002 ...
Page 56: ...Electrical Specifications 56 Document Number 318080 002 ...
Page 65: ...Document Number 318080 002 65 Mechanical Specifications Figure 3 8 Volumetric Height Keep Ins ...
Page 70: ...Mechanical Specifications 70 Document Number 318080 002 ...
Page 86: ...Pin Listing 86 Document Number 318080 002 ...
Page 138: ...Features 138 Document Number 318080 002 ...
Page 140: ...Boxed Processor Specifications 140 Document Number 318080 002 ...
