Product Specifications
R
Intel
®
848P Chipset Thermal Design Guide
9
2 Product
Specifications
2.1 Package
Description
The MCH is available in a 37.5 mm [1.48 in] x 37.5 mm [1.48 in] Flip Chip Ball Grid Array
(FC-BGA) package with 932 solder balls. The die size is currently 9.73 mm [0.383 in] x 9.73 mm
[0.383 in] and is subject to change. A mechanical drawing of the package is shown in Figure 14,
Appendix A.
2.1.1
Non-Grid Array Package Ball Placement
The MCH package uses a “balls anywhere” concept. Minimum ball pitch is 1.0 mm [0.039 in], but
ball ordering does not follow a 1mm grid. Board designers should ensure correct ball placement
when designing for the non-grid array pattern. For exact ball locations relative to the package, refer
to the
Intel
®
848P Chipset Datasheet.
Figure 1. MCH Non-Grid Array
Non standard grid ball pattern. Minimum pitch = 1.0 mm [0.039 in]
Shifted Grid
Std Grid w/ Depop
37.5mm x 37.5mm Substrate [1.48 in x 1.48 in]
.
