Intel 848P, Thermal Design Manual

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R
Intel
®
848P Chipset Thermal Design Guide 3
Contents
1 Introduction..........................................................................................................................7
1.1 Terminology ............................................................................................................7
1.2 Reference Documents ............................................................................................8
2 Product Specifications .........................................................................................................9
2.1 Package Description...............................................................................................9
2.1.1 Non-Grid Array Package Ball Placement ................................................9
2.2 Thermal Specifications .........................................................................................10
2.3 Thermal Design Power (TDP)...............................................................................10
2.3.1 Methodology..........................................................................................11
2.3.2 Application Power..................................................................................11
2.3.3 Specifications ........................................................................................11
2.4 Mechanical Specifications.....................................................................................11
3 Thermal Metrology.............................................................................................................13
3.1 Case Temperature Measurements.......................................................................13
3.1.1 Thermocouple Attach Methodology.......................................................13
3.2 Thermal Mechanical Test Vehicle.........................................................................15
3.2.1 TMTV Daisy Chain Operation ...............................................................15
3.2.2 TMTV Thermal Operation .....................................................................17
3.2.2.1 Recommended Test Parameters.........................................18
3.2.2.2 TMTV Correction Factors ....................................................18
3.3 Airflow Characterization ........................................................................................19
4 Reference Thermal Solution..............................................................................................21
4.1 Operating Environment.........................................................................................21
4.2 Mechanical Design Envelope................................................................................22
4.3 Thermal Solution Assembly ..................................................................................22
4.3.1 Alternate WSHS for Non-Rotated MCH ................................................23
4.3.2 Manufacturing with the WSHS ..............................................................23
4.3.2.1 Assembly Process Settings .................................................23
4.3.2.2 Inspection Criteria ................................................................23
4.3.3 WSHS Removal and Installation Procedure .........................................24
4.3.3.1 Removal via Lead Clipping Methodology.............................24
4.3.3.2 Removal via De-Soldering Methodology..............................26
4.3.3.3 Re-Installation Methodology.................................................27
4.4 Environmental Reliability Requirements ...............................................................28
Appendix A: Enabled Suppliers.................................................................................................................29
Appendix B: Mechanical Drawings............................................................................................................31