Thermal Metrology
R
Intel
®
848P Chipset Thermal Design Guide
17
Figure 5. Example Complementary Test Board Connections
Package
Trace
Board
Trace
DC Row
Isolation
Test
Points
Via to
Board
Backside
3.2.2
TMTV Thermal Operation
The heater located within the TMTV die should be accessed by connecting two sets of eight (8)
solder balls to each side of a power supply in parallel. The heater consists of a resistor and the
polarity of the power supply connections is arbitrary. The package balls to access the heater are
identified in Table 4. Ball reference designations can be found in Figure 4 and Figure 5. A graphical
representation of the die heater and its connections are shown in Figure 6.
Table 4. TMTV Heater Connections
Ball Designation
Connection
AK10, AM9, AL9, AM10, AL10, AG11, AK9, AN10
Heater End 1
AG28, AF28, AF29, AG27, AH27, AG29, AH26, AH29
Heater End 2
Figure 6. TMTV Die Heater Representation
HEATER
END 1
HEATER
END 2
