Case Temperature Reference Metrology
R
80
Thermal/Mechanical Design Guide
D.6
Thermocouple Attach Procedure
D.6.1
Thermocouple Conditioning and Preparation
1.
Use a calibrated thermocouple as specified in Sections D.3 and D.4.
2.
Measure the thermocouple resistance by holding both wires on one probe and the tip of
thermocouple to the other probe of the DMM (measurement should be about~75 ohms for
40-gauge type T thermocouple).
3.
Straighten the wire for about 38 mm [1 ½ inch] from the bead to place it inside the channel.
4.
Bend the tip of the thermocouple at approximately 45 degree angle by about 0.8 mm
[0.030 inch] from the tip (Figure 30).
Figure 30. Bending the Tip of the Thermocouple
D.6.2
Thermocouple Attachment to the IHS
5.
Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple
attachment.
6.
Place the thermocouple wire inside the groove; letting the exposed wire and bead extend
about 3.2 mm [0.125 inch] past the end of groove. Secure it with Kapton tape (Figure 31).
Summary of Contents for 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Page 14: ...Introduction R 14 Thermal Mechanical Design Guide ...
Page 38: ...Thermal Management Logic and Thermal Monitor Feature R 38 Thermal Mechanical Design Guide ...
Page 52: ...Intel Thermal Mechanical Reference Design Information R 52 Thermal Mechanical Design Guide ...
Page 60: ...Acoustic Fan Speed Control R 60 Thermal Mechanical Design Guide ...
Page 72: ...Heatsink Clip Load Metrology R 72 Thermal Mechanical Design Guide ...
Page 99: ...Mechanical Drawings R Thermal Mechanical Design Guide 99 Figure 50 Reference Fastener Sheet 1 ...
Page 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
