LGA775 Socket Heatsink Loading
R
Thermal/Mechanical Design Guide
63
Figure 22. Board Deflection Definition
d1
d2
d’1
d’2
A.2.3
Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL – d_ref
≥
0.09 mm and d_EOL – d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm and d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all
times.
2. Board deflection should not exceed motherboard manufacturer specifications.
Summary of Contents for 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Page 14: ...Introduction R 14 Thermal Mechanical Design Guide ...
Page 38: ...Thermal Management Logic and Thermal Monitor Feature R 38 Thermal Mechanical Design Guide ...
Page 52: ...Intel Thermal Mechanical Reference Design Information R 52 Thermal Mechanical Design Guide ...
Page 60: ...Acoustic Fan Speed Control R 60 Thermal Mechanical Design Guide ...
Page 72: ...Heatsink Clip Load Metrology R 72 Thermal Mechanical Design Guide ...
Page 99: ...Mechanical Drawings R Thermal Mechanical Design Guide 99 Figure 50 Reference Fastener Sheet 1 ...
Page 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
