Processor Thermal/Mechanical Information
R
Thermal/Mechanical Design Guide
15
2 Processor
Thermal/Mechanical
Information
2.1 Mechanical
Requirements
2.1.1 Processor
Package
The Pentium 4 processor is packaged in a 775–land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the processor
datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface mount
socket. The socket contains 775 contacts arrayed about a cavity in the center of the socket with
solder balls for surface mounting to the motherboard. The socket is named LGA775 socket. A
description of the socket can be found in the
LGA775 Socket Mechanical Design Guide
.
The package includes an integrated heat spreader (IHS) that is shown in Figure 1 for illustration
only. Refer to the processor datasheet for further information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this document.
Figure 1. Package IHS Load Areas
To p Su rfa c e o f IHS
to in s ta ll a h e a ts in k
IHS Ste p
to in te rfa c e w ith LGA775
So c ke t Lo a d P la te
Su bs tra te
To p Su rfa c e o f IHS
to in s ta ll a h e a ts in k
IHS Ste p
to in te rfa c e w ith LGA775
So c ke t Lo a d P la te
Su bs tra te
Summary of Contents for 640 - Pentium 4 640 3.2GHz 800MHz 2MB Socket 775 CPU
Page 14: ...Introduction R 14 Thermal Mechanical Design Guide ...
Page 38: ...Thermal Management Logic and Thermal Monitor Feature R 38 Thermal Mechanical Design Guide ...
Page 52: ...Intel Thermal Mechanical Reference Design Information R 52 Thermal Mechanical Design Guide ...
Page 60: ...Acoustic Fan Speed Control R 60 Thermal Mechanical Design Guide ...
Page 72: ...Heatsink Clip Load Metrology R 72 Thermal Mechanical Design Guide ...
Page 99: ...Mechanical Drawings R Thermal Mechanical Design Guide 99 Figure 50 Reference Fastener Sheet 1 ...
Page 103: ...Mechanical Drawings R Thermal Mechanical Design Guide 103 Figure 54 Clip Heatsink Assembly ...
