Honeywell bendis king KLN 94, Maintenance Manual

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BENDIX/KING KLN 94
Page 5-26 15599M00.JA Rev 0, Sept/2000
NOTE:
Solvents may be physically applied in several ways
including agitation, spraying, brushing, and vapor
degreasing. The cleaning solvents and methods
used shall have no deleterious effect on the parts,
connections, and materials being used. If sensitive
components are being used, spray is recommended.
Uniformity of solvent spray flow should be maxi-
mized and wait-time between soldering and cleaning
should be minimized.
NOTE:
Clean each module subassembly. Then remove any
foreign matter from the casting.
Remove each module subassembly. Then remove any for-
eign matter from the casting.
(a) Casting covers and shields should be cleaned as follows:
(1) Remove surface grease with a lint-free cloth.
(2) Blow dust from surfaces, holes, and recesses using
an air stream.
(3) If necessary, use a solvent, and scrub until clean,
working over all surfaces and into all holes and re-
cesses with a suitable non-metallic brush.
(4) Position the part to dry so the solvent is not trapped
in holes or recesses. Use an air stream to blow out
any trapped solvent.
(5) When thoroughly clean, touch up any minor damage
to the finish.
(b) Assemblies containing resistors, capacitors, rf coils, induc-
tors, transformers, and other wired parts should be cleaned
as follows:
(1) Remove dust and dirt from all surfaces, including all
parts and wiring, using soft-bristled brushes in con-
junction with air stream.
(2) Any dirt that cannot be removed in this way should
be removed with a brush (not synthetic) saturated
with an approved solvent, such as mentioned above.
Use of a clean, dry air stream (25 to 28 psi) is recom-
mended to remove any excess solvent.
(3) Remove flux residue, metallic chips, and/or solder
balls with an approved solvent.
(c) Wired chassic devices containing terminal boards, resistor
and capacitor assemblies, rf coils, switches, sockets, induc-
tors, transformers, and other wired parts should be cleaned
as follows: