Appendix C: Specifications and Physical Description 98
.
C • Appendix C: Specifications and Physical Description
The
SBC622
assembly
offers
the
ability
of
targeting
multiple
levels
of
environmental
support.
The
following
tables
list
Level
1,
2,
4,
and
5
support:
C.1 Specifications
Table C-1 Environmental Specifications by Level
C.2 Heatsink and Conduction Plate Members
The
heat
sink
or
conduction
cooled
plate
provided
for
the
SBC622
are
required
to
remove
over
37
W
of
heat
from
the
Core
i7
processor
in
addition
to
over
40
W
combined
from
the
remainder
of
the
board.
The
thermal
relief
solution
is
required
to
support
the
operating
temperature
ranges
listed
in
above,
over
silicon
with
Tjmax
ratings
of
100
°
C.
C.3 Reliability Requirements
•
The
SBC622
assembly
has
obtained
CE
mark.
•
The
SBC622
is
fully
compliant
with
the
European
Union
RoHS
and
WEEE
directives.
Level 1
Level 2
Level 4
Level 5
Cooling Method
Convection
Convection
Conduction
Conduction
Conformal Coating
Optional
Standard
Standard
Standard
High/Low Temperature
0
°
C
το
55
°
C -20
°
C
το
65
°
C -40
°
C
το 75°
C -40
°
C
το
85
°
C
Operational
(300 lfm)
(300 lfm)
at cold wall
at cold wall
Random Vibration
0.002g
2
/Hz* 0.002g
2
/Hz* 0.1g
2
/Hz** 0.1g
2
/Hz**
Shock
20g***
20g***
40g***
40g***
* With a flat response to 1000 Hz, 6dB/Oct roll-off from 1000 to 2000 Hz
** From 10 to 1000 Hz
***Peak sawtooth 11 ms duration
Summary of Contents for OpenVPX VPXcel6 SBC622
Page 2: ...Document History Hardware Reference Document Number 500 9300527818 000 Rev B March 18 2011 ...
Page 33: ...Installation and Setup 33 Figure 1 3 PMC Installed onto 2 PMC Site Model F ...
Page 37: ...Installation and Setup 37 Figure 1 5 Front Panel SBC622 Isometric View Convection cooled F F ...
